SSM Semiconductor Packaging Mold Innovation Improves Yield And Reliability

As a leading company in the semiconductor industry, SSM has extremely strict requirements for packaging technology. ShunKing Park Company has improved the packaging yield of SSM products by 20% and enhanced the long-term reliability of the products by developing new aluminum alloy die-casting molds and optimizing the design of tooling fixtures. This technological innovation has been highly recognized by SSM, and the two parties have cooperated for more than 15 years.